IBM to produce Microns Hybrid Memory Cube

R&D Mag -
IBM and Micron Technology Inc. announced that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology.
IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting. ... 続きを読む

http://www.rdmag.com/News/2011/12/Information-Technology-Computer-Technology-IBM-To-Produce-Microns-Hybrid-Memory-Cube/

Posted in: CMOS,IBM,発表/リリース/開始